Our company specialises in the design and manufacture of machinery of integrated circuits, multi chip modules, microstructures, optoelectronic devices and sensors. Over the years, we have maintained a significant profile within the telecommunications industry, offering a range of manual and semi-automatic die attach equipment, capable of bonding delicate devices to a placement accuracy of 5 microns. During our 15 year history we have sold equipment to major companies either directly through our network of agents, to countries such as Japan, China, Korea, Malaysia, USA and most countries within Europe.

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